H3C Semiconductor designers used Ansys' comprehensive multiphysics platform — including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC — to engineer a state-of-the-art network processor chip featuring ...

Electro Magnetic Applications, Inc. (EMA) and Ansys are collaborating to deliver an enhanced design-to-validation workflow to assess and manage risks associated to material charging in space plasma ...

Under a cooperative research and development agreement, Ansys and L3Harris Technologies are working with the U.S. Army Combat Capabilities Development Command (CCDC) Aviation & Missile Center (AvMC) ...

H3C Semiconductor leveraged Ansys Inc (NASDAQ: ANSS) simulation solutions is set to roll out ENGIANT 660 network processor chip that permitted routing, AI, 5G backhaul, and cybersecurity applications.

PITTSBURGH, June 11, 2020 /PRNewswire/ -- Electro Magnetic Applications, Inc. (EMA) and Ansys (NASDAQ: ANSS) are partnering to deliver an enhanced design-to-validation workflow for certifying cable ...

GUC engineers are using Ansys HFSS 3D Layout’s advanced simulation workflow to speed advanced integrated circuit (Advanced-IC) design The workflow helps GUC rapidly incorporate its die-to-die solution ...

Two of the engineering software market’s largest players are set to join forces in a $35 billion cash-and-stock deal. Synopsys Inc., which makes chip design software, today announced that it will pay ...

With its detailed, step-by-step explanations, and extensive worked examples and sample problems, this book will develop readers' understanding of FEA and their ability to use ANSYS' software tools to ...

H3C Semiconductor designers used Ansys’ comprehensive multiphysics platform – including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC – to engineer a state-of-the-art network processor chip featuring ...

H3C Semiconductor designers used Ansys’ comprehensive multiphysics platform – including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC – to engineer a state-of-the-art network processor chip featuring ...