AMKR's AI and HPC packaging demand is climbing as data-center programs ramp, advanced packaging expands and Arizona investment rises to $12 billion.

SNS Insider estimated, the Global Semiconductor Manufacturing Equipment Market is projected to reach USD 279.63 billion by ...

By Wen-Yee Lee TAIPEI, Sept 21 (Reuters) - Taiwan broke ground on a new advanced packaging industrial park in the southern ...

AI, robotics and connected systems are reshaping packaging automation, helping manufacturers improve flexibility, quality and ...

Shares in Biwin Storage Technology soared by as much as 5.2 percent today after the Chinese provider of semiconductor memory solutions and advanced packaging and testing products said it will invest ...

Intel Malaysia is expanding advanced packaging capabilities in Penang as AI chips require more complex assembly, testing, and more.

The biggest hurdle in the AI boom has shifted. Etching the tiniest transistor is no longer the whole story. What is becoming more important is which companies can turn out packaged chips quickly, ...

AMD Is Investing More Than $10 Billion in Taiwan to Build Advanced Chip Packaging With TSMC. Here's What Lisa Su Is Actually Buying With That Money. AMD's biggest AI challenge may no longer be winning ...

Malaysia could capture a larger share of the global semiconductor boom by moving deeper into advanced packaging, a segment increasingly critical to artificial intelligence (AI) chips, according to ...

When Intel opened its first overseas manufacturing facility in Penang in 1972, Malaysia’s role was largely to assemble chips ...