SK Hynix will invest 19 trillion won in a new advanced chip packaging facility in Cheongju to boost capacity for AI-driven ...

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

The chiplet design movement is gathering steam, and the availability of one-stop advanced packaging solutions is a testament to this semiconductor technology’s advancement toward mass production. Such ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

One of the most amazing things that human civilization has created is the silicon chip, with semiconductor technology not just about the 'CPU' or the 'GPU' anymore... but rather advanced packaging ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

DIGITIMES Research analyst Eric Chen notes that process scaling has been the core driver of Moore's Law in semiconductors. However, with short-channel effects emerging, the three leading foundries ...

Chiplets have generated a lot of interest in recent years as design engineers look for alternatives to traditional system-on-chip technology to house complex, multi-function electronics. At the ...