By Wen-Yee Lee TAIPEI, Sept 21 (Reuters) - Taiwan broke ground on a new advanced packaging industrial park in the southern ...

AMKR's $12B Arizona expansion adds major advanced packaging capacity, backed by customer commitments and key TSMC and NVIDIA partnerships.

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

CDNS is benefiting from rising AI complexity, driving demand for advanced packaging, 3D-IC and differentiated IP.

TSMC is expanding advanced-packaging capacity as demand from Nvidia and other chip designers continues to rise. KLA, Camtek, ...

Biwin Storage Technology invests US$672 million in latest example of a storage firm looking to upgrade its business model Chinese storage makers, long known for packaging chips into modules, have been ...

TAICHUNG, Taiwan (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...

GlobalFoundries has signed a Memorandum of Understanding with Singapore's Agency for Science, Technology and Research (A*STAR) to enhance its advanced packaging capabilities in response to the growing ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Samsung and Qualcomm are reportedly forming a 2.1D Packaging Alliance to provide customers with access to advanced chip ...

Aug 1 (Reuters) - Taiwanese chipmaker TSMC (2330.TW), opens new tab has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics (005930.KS) ...