With the SG-BGA-7219 elastomer socket from IronwoodElectronics, you can test Samsung e-MMC (embedded MultiMediaCard) deviceshoused in 0.5-mm pitch, 14×18-mm array BGA packages. The e-MMC is an ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

CUI Devices’ Thermal Management Group has expanded its heat sink product portfolio with the addition of BGA heat sinks. The HSB family, designed for ball grid array (BGA) devices, supports a range of ...

Designed for high frequency CSP and BGA devices with pitches from 0.5 mm through 1.27 mm, these RF test sockets employ a spring probe contact that ensures more than 500,000 insertion/withdrawal cycles ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first NVMe* PCIe ...

Ironwood Electronics’ CBT-BGA 7010 ball-grid-array (BGA) socket addresses the high-performance requirements involved in testing BGA devices. The stamped spring pin contactor features 26-gram actuation ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Toronto, Ontario--(Newsfile Corp. - September 23, 2019) - Relay Medical Corp. (CSE: RELA) (OTCQB: RYMDF) (FSE: EIY2) ("Relay" or the "Company"), an engine for MedTech innovation, is pleased to ...

A well-orchestrated PCB design and assembly plan is required to successfully implement techniques such as underfill in next generation OEM embedded consumer and mobile designs. Two distinct market ...

We've said this before and the same rings true time and time again, the PC Hardware Industry always has a place for something new and innovative. Too often products are brought to market with a "me ...