The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...

LG Innotek developed the world's first "copper post" technology, a solution needed for the latest smartphones. This technology allows for denser circuitry for smaller, higher-performance semiconductor ...

Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates... Taiwan IC backend ...

Taiwan-based PCB makers, including Unimicron Technology and Tripod Technology, have received more windfall orders from Japan-based PCB vendors due to the appreciation of the Japanese... IC substrate ...

A substrate that connects an FC-CSP, a package with a substrate mounted with flipped high-performance semiconductor chips for a shorter and more efficient electrical connection between the chips and ...