The immense processing power generated by today’s cutting-edge ICs enables engineers to design extremely powerful applications. Unfortunately, the higher processing power comes with a dramatic ...

Ventiva(R), a leader in thermal solutions, today at CES 2026 unveiled its Zoned Cooling(TM) reference design, a new architectural approach to thermal management that transforms how heat is managed in ...

TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...

With August kicking into high gear, heat is probably at the top of most comm system designers' minds. The reality, however, is that heat should be on their minds all year round. As system ...

A new technical paper titled “Glacierware: Hotspot-aware Microfluidic Cooling for High TDP Chips using Topology Optimization” was published by researchers at Corintis. “The continuous increase in ...

In the run up to the September 1 reveal of next-gen GeForce graphics cards running on Nvidia’s cutting-edge Ampere GPU architecture, the company let its thermal, mechanical, electrical, and industrial ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

Posts from this topic will be added to your daily email digest and your homepage feed. is a senior editor and author of Notepad, who has been covering all things Microsoft, PC, and tech for over 20 ...

We consulted a mechanical engineer and heat transfer specialist* to get his opinion on how Tesla might design the cooling system for its new 4680 integrated battery system. The analysis suggests that ...

Quiet gaming PC builds rely on smart cooling, airflow tuning, and case design to reduce noise while maintaining strong ...