Electronic Design

Die-Attach Process Dramatically Improves Waste-Heat Removal in Power Electronics

QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...
AZOM

QPT Solves Major Problem of Waste Heat Removal in Power Electronics with Novel Die Attach Process

The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...
Yahoo Finance

Insights on the Die Attach Equipment Global Market to 2027 - Drivers, Restraints, Opportunities & Threats

Dublin, July 07, 2020 (GLOBE NEWSWIRE) -- The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment ...
Yahoo Finance

The global die attach machine market was valued at $1,129.0 million in 2020, and is projected to reach $1,813.1 million by 2028, registering a CAGR of 6.1% from 2021 to 2028

New York, Aug. 25, 2021 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Die Attach Machine Market by Type, Technique, and Application : Global Opportunity Analysis and ...
Semiconductor Engineering

Study Of Bondable Laser Release Material Using 355nm Energy To Facilitate RDL-First And Die-First Fan-Out Wafer-Level Packaging (FOWLP)

Click here to view the article page on IEEE.
Business Wire

Global Die Attach Equipment Market Outlook (2018 to 2027) Featuring Panasonic, West-Bond & Hybond Among Others - ResearchAndMarkets.com

DUBLIN--(BUSINESS WIRE)--The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment market is expected ...