The PCI-Express standards-setting organization is creating a thin interconnect that would link mobile devices such as smartphones and tablets to external peripherals, the organization’s chief said on ...

Backed with competitive intelligence and benchmarking, our research reports on the molded interconnect device (MID) market are designed to provide entry support, customer profile and M&As as well as ...

Interconnects are becoming much more problematic as devices shrink and the amount of data being moved around a system continues to rise. This limitation has shown up several times in the past, and ...

Agere Systems Inc. of Allentown, Pa., today said Siemens AG of Munich, Germany, has purchased a number of the company’s broadband interconnect devices for its telecommunications equipment. Details of ...

LONDON--(BUSINESS WIRE)--Technavio has been monitoring the molded interconnect device (MID) market and it is poised to grow by USD 862.93 million during 2020-2024, progressing at a CAGR of over 12% ...