SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
Editor’s note: It’s not enough to choose an IC for your design just by what is in the data sheet; you will need to choose the right package and pay attention to the manufacturing and assembly needs of ...
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