ASE Technology (NYSE:ASX) delivers semiconductor assembly, testing, and IC packaging services, supporting engineering, supply ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging ...

A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...

As the semiconductor industry moves to smaller scales, it must overcome several technical challenges. In 2025, we expect three key developments to make headlines: Gate-All-Around transistor designs, ...

With a focus on transforming India into a semiconductor powerhouse, Tata Electronics, led by N Chandrasekaran, has committed ...

Ensuring chip facilities have local supply chains and customers will decide whether India’s chip ambition becomes a costly ...

Malaysia stands at a pivotal moment. A crucial player in the global semiconductor assembly and test (OSAT) landscape, the ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.

In the semiconductor industry, the outsourced semiconductor assembly and test (OSAT) sector plays a pivotal role in the global technology landscape. As the backbone of electronic device manufacturing, ...