A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
The SG-BGA-7199 socket isdesigned for 13.5 x 8 x 1.2mm package size and operates at bandwidths up to 10GHz with less than 1dB of insertion loss. The contact resistance is typically20 milliohms per I/O ...
As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...
China has had a long history of supporting its semiconductor development with industrial policies. The "Outline for advancing the national IC industry" announced in 2014 upgraded semiconductors from a ...
The global semiconductor market reached US$575.1 billion in 2022, but the figure only covers the IC design and IDM sectors. The entire semiconductor value chain should come close to US$1 trillion if ...
Analysts estimate that the global market for semiconductors will exceed $600 billion in 2025 and hit the $1 trillion mark by 2030, suggesting a CAGR of over 8%. It’s no surprise that the drivers ...
At last month’s Fabless Semiconductor Association (FSA) Awards (the FSA is now the Global Semiconductor Association, or GSA), Gordon Campbell, recipient of the Dr. Morris Chang Exemplary Leadership ...
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