The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

DELRAY BEACH, Fla., Oct. 31, 2025 /PRNewswire/ -- The MEMS packaging substrate market is expected to grow from USD 2.40 billion in 2025 to USD 3.23 billion by 2030, at a CAGR of 6.1% according to a ...

The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects aim to develop ...

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...

As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce ...

Taiwan Semiconductor Manufacturing (NYSE:TSM) is thinking of building advanced packaging capacity in Japan, Reuters reported people with knowledge of the matter. One option being evaluated by the ...