Thermal interface materials (TIMs) are composed of thermal fillers and matrix materials. Thermal fillers are highly thermally conductive substances, while matrix materials are typically used to ...

With the ever-increasing need for heat dissipation, high-performance thermal interface materials (TIMs) with higher thermal conductivity and other properties are becoming essential. Driven by this ...

Why it matters: Data centers are hot, both figuratively and literally. As we feed more and more data and processing demands into these server farms, keeping them from overheating is becoming an ...

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The calculation and/or the measurement of the thermal conductivity of materials is a fundamental challenge in materials science, essential for developing technologies in energy management, electronics ...

Chip package cross-section — moisture ingress pathways. Vertical cross-section of a 2.5D AI chip package. Layers from bottom to top: PCB/FR-4, BGA solder balls, organi ...

Written by Dr. Pradyumna (Prady) Gupta, Founder & CEO of Infinita Lab and Infinita Materials. As electronic devices and EV systems continue to push the boundaries of power density and miniaturization, ...

Thermal management deals with problems arising from heat dissipation, thermal stresses and warping. It is critical in the packaging of power semiconductors and other microelectronic and optoelectronic ...

A team led by University of Minnesota Twin Cities scientists and engineers discovered a new method for tuning the thermal conductivity of materials to control heat flow "on the fly." Their tuning ...