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Abstract: The electrostatic discharge (ESD) protection design and verification methodology are particularly important for the wafer-on-wafer (WoW) stacked system due to the miniaturization of vertical ...
Abstract: Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction ...
We are distinctive in the wide range of research we undertake as a department, in particular in our application of core mathematics to other disciplines such as climate science, biology, and computer ...
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