MIT electronics researchers develop a new way to fabricate transistors on the backend of finished dies, to keep pushing the limit of chip densities ever higher

Traditional CMOS chips are fabricated by applying and then etching repeated layers of different materials, applied to a wafer ...
Semiconductor Engineering

Tackling Chip Complexity With Integrated System-Level Test Solutions

Validate cross-chip data paths in multi-die packages and evaluate the impact on power, performance, and reliability.