The revamped cookies are part of a premeditated flavor rampage that Oreo heralded a few weeks ago. It was quite helpful in ...

The production of iPhones in India is just going to get larger and larger, with a new report saying that Apple has entered into preliminary talks to start packaging chips in the country. Apple's work ...

Apple is in talks with suppliers to manage iPhone chip assembly and packaging in India for the first time, reports The Economic Times. "Exploratory conversations" are said to have taken place with ...

More than 10 years after its initial launch, a popular Oreo flavor is making its way back to shelves. Mondelēz announced the return of the Cookie Dough Oreo, first introduced in 2014, on Monday, Dec.

A brand-new sugar-free Oreo variety is set to hit grocery shelves across the country in January 2026 — and social media users are skeptical. The Oreo website was updated Tuesday to introduce the brand ...

In a reflection of these calorie-controlled times, sugar-free Oreos are set to hit shelves in the U.S. next year. Parent company Mondelez has confirmed that Oreo Zero Sugar and Oreo Double Stuff Zero ...

The cookies, available in regular in Double Stuf, will be permanently additions to the cookie brand's portfolio Sabrina Weiss is the Editorial Assistant of PEOPLE's food department. She writes the ...

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...

Kat is a journalist with more than a decade of experience covering food, drink, and travel for Business Insider, Travel + Leisure, Entertainment Weekly, and other leading outlets. She writes with a ...

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...

Achieving the circuit densities we need for the next generation of electronics demands advanced packaging and chip-scale interconnect solutions. The need to look for alternative packaging solutions to ...