Abstract: High-speed wafer testing is a difficult problem in the automated mass production testing of integrated circuits. A vertical probe card for high-speed wafer test is designed in this paper.
Abstract: The spatial distribution of a transduction efficiency over the air-coupled probe surface was proposed as a convenient tool for the probe integrity inspection. In this research, a parabolic ...
The 326X Artificial Resistive Load is optimized for standardized testing environments requiring a fixed, high-current load. Delivering a stable 50A resistive load, the 326X simplifies repeatable test ...
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